学术论文
[1] B. Cui,C. Song*, H. J. Mao, J. J. Peng, F. Li, H. Q. Wu, G. Y. Wang, F. Zeng, F. Pan, Magnetoelectric coupling induced by interfacial orbital reconstruction,Advanced Materials, 2015, 27(1): 6651-6657.
[2] Lu N,Yang D, Li L. Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures[J].Acta Materialia, 2013, 61(12): 4581-4590.
[3]Yang D, Cai J, Wang Q, et al. IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling[J].Journal of Materials Science: Materials in Electronics, 2015, 26(2): 962-969.
[4]Yang D, Yang G, Li L. Microstructure and morphology of interfacial intermetallic compound CoSn3in Sn–Pb/Co–P solder joints[J].Microelectronics Reliability, 2015, 55(11): 2403-2411.
[5] Li S,Yang D, Tan Q, et al. Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi2Te3 Thermoelectric Material[J].Journal of Electronic Materials, 2015, 44(6): 2007-2014.
[6]Yang D, Yang G, Cai J, et al. Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization:2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015. (BestPaperAward)
[7]冉藤,樊涛,杨栋华*等. α-CoSn3IMC弹性模量各向异性的第一性原理,焊接学报, 2021, 42(6): 71-76.
[8]Donghua Yang, Teng Ran,Xiang Zhai, et al.Theoretical Investigation of the thermodynamic stability and Density of States in α-(Co,Cu)Sn3,2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020.
3.专利
[1]杨栋华;等.一种贴片式磁性元器件引脚的连接封装方法.2018.12.06,中国发明专利, ZL2016105543272
[2]杨栋华;等.一种船舶发动机缸套的制造方法. 2018.8.10,中国发明专利, CN2018109090054.
[3]杨栋华;等.一种BGA板电迁移测试装置. 2019.6.10,中国发明专利, CN2019104949475.
[4]杨栋华;等.一种电子封装微焊点的可靠性评价方法. 2019.2.20,中国发明专利, CN2019101269751.
[5]杨栋华;等.一种具有[100]择尤取向的全IMC微焊点的制备方法. 2019.9.29,中国发明专利, CN2019109298131.
[6]杨栋华;等.一种用于电子元件的快速冷热冲击实验装置及方法, 2019-6-26,中国发明专利,CN201910560572.8.
[7]杨栋华;等.一种电子封装微焊点在高温条件下的热迁移实验装置. 2019.9.29,中国发明专利,CN201910929814.6.
[8]杨栋华;等.一种抑制界面IMC生长的微焊点的制备方法.2021-8-3,中国发明专利, CN201911093840.6.
4.科技奖励
[1]许惠斌,杨栋华等,铝与钢的填丝搅拌摩擦焊集成技术，重庆市产学研合作促进会、四川省科技协同创新促进会，一等奖，2021年
