[1] Lu N, Yang D, Li L. Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures[J].Acta Materialia, 2013, 61(12): 4581-4590.
[2] Yang D, et al. IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling[J].Journal of Materials Science: Materials in Electronics, 2015, 26(2): 962-969.
[3] Yang D, Yang G, Li L. Microstructure and morphology of interfacial intermetallic compound CoSn3 in Sn–Pb/Co–P solder joints[J].Microelectronics Reliability, 2015, 55(11): 2403-2411.
[4] Li S, Yang D, et al. Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi2Te3 Thermoelectric Material[J].Journal of Electronic Materials, 2015, 44(6): 2007-2014.
[5] Yang D, et al. Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization:2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015. (Best Paper Award)
[6] Fei Du, Yang D*, Zhai X, et al. Interfacial reaction of micro Co-P/Solder/Co-P interconnection under large temperature gradients: 2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018.
[7] Ran T, Yang D*, Gan G, et al. First-principles calculations of elastic properties and electronic structure of α-CoSn3IMC: 2019 20th International Conference on Electronic Packaging Technology (ICEPT), 2019.
[8]杨栋华等.一种贴片式磁性元器件引脚的连接封装方法. ZL2016105543272,国家发明专利. CN106128742B
[9]杨栋华等.一种船舶发动机缸套的制造方法. ZL201810909005.4.国家发明专利.
[10]杨栋华等.一种电子封装微焊点的可靠性评价方法. ZL2019101269751.国家发明专利.
